In article number 1700061, Pengfei Bai, Krzysztof Kempa, Jinwei Gao, and co‐workers present a high performance flexible metallic crack‐nanonetwork (with the best figure of merit ≈20 000 at T ≈ 86.4% and Rs ≈ 0.13 Ω sq−1) by employing a sputtering/evaporation‐free, solution based process. This network outperforms the current industry standard, indium tin oxide (ITO), in performance and cost. In particular, the processing is fully compatible with R2R processing. It is therefore a viable, practical ITO replacement.