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Structure, Preparation, and Applications of 2D Material‐Based Metal–Semiconductor Heterostructures

封面设计 | First Published: 2021-01-18

Junyang Tan Shisheng Li Bilu Liu Hui-Ming Cheng

Abstract

Metal–Semiconductor Heterostructures

In article number 2000093, Bilu Liu, Hui‐Ming Cheng, and co‐workers highlight recent advances in structure, preparation, and applications of emerging two‐dimensional material‐based metal‐semiconductor heterostructures. Furthermore, the perspectives about the challenges and future research opportunities are given. Such heterostructures are suggested as promising candidates in 2D integrated electronics and high‐performance energy‐related devices.

原文链接

https://onlinelibrary-wiley-com.flyyouth.top/doi/abs/10.1002/sstr.202170001

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